发明名称 METHOD AND APPARATUS FOR CONTROLLING A MOLD MELT-FLOW PROCESS USING TEMPERATURE SENSORS
摘要 A method and apparatus controlling a mold melt flow using inner (impinge) and/or edge temperature sensors (316, 310, 312, 314). Thermal waveforms from thermal sensor array data such that if a sequence of melt temperature set- point trigger times fluctuates outside control limits, then the melt-flow is judged as a hotter/faster or cooler/slower melt-flow injection process. An initial melt temperature set-point "trigger" and second reference set-point "trigger" are combined to control the closure of at least one cavity gate in accordance with an injection melt-flow time and temperature profile. The nozzle orifice (310) area sets an initial melt-flow rate. Each mold cavity (318) final melt-flow "pack" volume is preferably contolled by a gate cavity melt shut-off system that is responsive to the sensed temperature(s), resulting in each cavity melt-flow injection process volume being held substantially constant, for a uniform resin "shrink" density.
申请公布号 CA2427832(C) 申请公布日期 2008.01.08
申请号 CA20012427832 申请日期 2001.11.05
申请人 BUJA, FREDERICK J. 发明人 BUJA, FREDERICK J.
分类号 B29C45/76;B29C45/77;B29C45/78 主分类号 B29C45/76
代理机构 代理人
主权项
地址
您可能感兴趣的专利