| 摘要 |
A suction apparatus (1) holds a wafer (W) by sucking the wafer (W) by vacuum. The suction apparatus (1) is provided with a suction base material (2). The suction base material (2) is provided with a plurality of pin-shaped protruding sections (2a) formed to have leading end planes (upper planes) at a same level, and has rigidity. The leading end planes of the protruding sections (2a) are coated with a coating layer having elasticity through a base layer (4). Even when a foreign material exists between the wafer (W) and a suction plane when the wafer (W) is sucked, the foreign material is buried in the coating layer (3), and planarity of the wafer (W) is improved. Furthermore, since the coating layer (3) can be made relatively thin, swelling of the wafer (W) can be reduced, and the planarity of the wafer (W) being sucked can be improved also from this point of view. |
