BONDING APPARATUS OF SEMICONDUCTOR PACKAGE

摘要

A semiconductor package bonding apparatus is provided to prevent damage of a die due to uniform pressure applied to the die by using an inspection unit for identifying contaminants on a bottom surface of a bonding head. A bonding head(14) is attached to an inside of a body to apply pressure to a semiconductor package. A contaminant inspection unit is positioned at a lower part of the boding head to identify contaminants on a bottom surface of the bonding head. A contaminant inspection unit is positioned at a lower part of the boding head to identify contaminants of a bonding stage. The contaminant inspection unit includes a light source(112) for emitting light, a cover(110) having a hole(116) for irradiating the light of the light source to the bottom surface of the bonding head, and a light receiving part(130) for receiving the light reflected on the bottom surface of the bonding head.