SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

A semiconductor device is provided to form a void-free semiconductor device between a semiconductor chip and an adhesion member disposed on the semiconductor chip by prevent a void between a semiconductor device and an adhesion film for stacking the semiconductor device on a substrate or another semiconductor device. A semiconductor device(100) includes a semiconductor chip(30) and an insulation layer. The semiconductor chip has a circuit part(15) formed in a first region(10) and a peripheral part formed in a second region(20) positioned in the periphery of the first region. The insulation layer covers the first and second regions and includes a void removing part(40) extended from the first region to the second region so as to avoid formation of a void. The void removing part is an opening exposing the semiconductor chip. A fuse box is disposed in the void removing part.