| 摘要 |
A PVD(Physical Vapor Deposition) target is provided to prevent a processing region from being contaminated by a bonding layer by not exposing the bonding layer to the processing region. A target assembly(310) includes a magnet assembly(350) housed in a magnetron chamber(309), and a target(311) bonded to a backing plate(312) by a bonding layer(313). A magnet assembly is an array of plural magnets that rotates or linearly translates parallel to the target to improve deposition rate and uniformity of a PVD(Physical Vapor Deposition)-deposited film on a substrate(331). A magnetron chamber(309) is at atmospheric pressure, is evacuated to a pressure below atmospheric pressure or is filled with an electrically insulating coolant. Power is provided to the target via an electrical connection which is electrically coupled to the backing plate to energize the target or is electrically coupled to the target directly.
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