| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To assure bonding strength even when the sidewall of an insulating substrate for mounting a lid is made narrow. <P>SOLUTION: A recess such as a trench 10 is formed in at least one of the upper surface at the sidewall 7 of a concave insulating substrate 1 and the lower surface of a lid 9 opposing it. The height is made uniform excepting the recess. Bonding area of the sidewall 7 and the lid 9 is increased through existence of the trench 10, and thereby bonding strength is enhanced. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
