发明名称 COMPONENT CONNECTING TERMINAL FOR SEMICONDUCTOR POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a component connecting terminal for a semiconductor power module for securely eliminating a dangerous void, even when processes vary to some extent as to a Cu electrode lead terminal, a shunt resistance terminal, a jumper line terminal, etc., for the power module. SOLUTION: A hole is bored in a center of a lead electrode surface where a void is trapped, and the chimney effect of the hole is used to smoothly discharge gas from the top. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007335767(A) 申请公布日期 2007.12.27
申请号 JP20060168256 申请日期 2006.06.19
申请人 HITACHI LTD 发明人 SOGA TASAO;MORIZAKI HIDEKAZU;SHIRAHAMA HIDEFUMI
分类号 H01L25/07;H01L23/50;H01L25/18 主分类号 H01L25/07
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