| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of potting molding and of forming an optical semiconductor-sealing material which is colorless and transparent, and has excellent UV durability and heat resistance; and to provide an optical semiconductor element sealed with the same. <P>SOLUTION: The thermosetting rein composition contains (A) a polyorganosiloxane having an epoxy equivalent of at most 1,600 g/mol, and (B) a metal chelate compound. The optical semiconductor element is sealed with the composition. <P>COPYRIGHT: (C)2008,JPO&INPIT |
