| 摘要 |
A test device having a needle buffer unit is provided to absorb impact if wafers which are mounted on the needle and a chuck of a probe are contacted each other with an excessive force, by installing a buffer unit at a lower portion of the chuck. A probe card(100) having a plurality of probe needles(110) is connected to a semiconductor chip formed on a wafer to perform an electric test. A probe chuck(200) is installed at the lower portion of the probe card, and a wafer is mounted at the upper portion of the probe chuck and elevated. A buffer unit is installed at the lower portion of the probe chuck, and absorbs an impact applied to the probe chuck.
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