PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD

摘要

An ink jet print head (100) includes a silicon ink jet chip (104), a print head holder (102), configured to carry and support the silicon chip, and a glass plate (118), bonded between the silicon chip and the print head holder. The ink jet chip (104) has a coefficient of thermal expansion a_s. The print head holder (102) has a holder wall thickness, and a coefficient of thermal expansion ah that is substantially different from a_s. The glass plate (118) has a coefficient of thermal expansion a_g that is substantially similar to a_s, and a thickness at least as great as the holder wall thickness, whereby stress created by differential thermal expansion between the silicon chip (104) and the holder (102) is attenuated by the glass plate.