| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the manufacturing process of a solid-state imaging apparatus is complicated in order to make the solid-state imaging apparatus thin. SOLUTION: The solid-state imaging apparatus 1 includes: a solid-state imaging element (hereinafter called as an element) 2; a substrate 3 to one principal side 3a of which the element 2 is fitted; a transparent plate 5 for sealing a micro lens array 4 of the element 2 fitted to the substrate 3; bonding wires 8 connecting connection pads 6 of the element 2 and connection lands 6 of the substrate 3 to each other; and a resin sealing member 9 for sealing the bonding wires 8. The substrate 3 includes a light receiving opening 11 for housing the micro lens array 4 of the element 2, and pad openings 12 to which the connection pads 6 of the element 2 are inserted, the element is fitted to the one principal side 3a of the substrate 3 in a state that the micro lens array 4 is located in the light receiving opening 11 and the connection pads 6 are located at the pad openings 12, and the transparent plate 5 is adhered to the other principal side 3b of the substrate 3 in a state of closing the light receiving opening 11. COPYRIGHT: (C)2008,JPO&INPIT
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