| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing an increase in cost and in thickness, and mounting an electronic component having a large thickness. SOLUTION: The semiconductor device 10 comprises the electronic component 12 mounted on an interconnection substrate 11 and a plug 13 for plug connection. A plug adapter 20 having a plurality of plug terminals 24 on its surface respectively connected to an interconnection 15 within the interconnection substrate 11 is mounted on a lower edge part of the interconnection substrate 11, and the plurality of plug terminals 24 comprise the plug 13 in their entirety. COPYRIGHT: (C)2008,JPO&INPIT |
