| 摘要 |
A method and an apparatus for inspecting a chip LED surface are provided to automatically detect failed chip LEDs according to various types of the chip LEDs. An apparatus for inspecting a chip LED surface includes an inclined part(21) and a cylindrical part(22). The inclined part has a slope lighting(24) with white LEDs(23) in a plurality of layers with a ring type which has a strong directionality. The light emitted from the white LEDs illuminates a surface of a wafer(25) of the chip LEDs to be inspected. A vertical lighting(27) illuminates the wafer surface of the LED through a lens after the vertical lighting is reflected to a half mirror(28). The control unit controls on-off of the vertical lighting and the slope lighting. The control unit transmits position information to a map file of failed chip LEDs by determining as the failed chip LEDs when the image photographed during the vertical lighting is different from a reference image of the vertical lighting and when the image photographed during the slope lighting is different from a reference image of the slope lighting.
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