| 摘要 |
<p>In the case of a projection exposure method for exposing a radiation-sensitive substrate, arranged in the region of an image surface of a pro-jection objective, with at least one image of a pattern of a mask arranged in the region of an object surface of the projection objective, a mask is arranged in the region of the object surface of the projection objective, the mask having a first pattern area with a first subpattern, and at least one second pattern area, arranged laterally offset from the first pattern area, with a second subpattern. The mask is scanned by relative move-ment between the mask and the illumination field of the illumination sys-tem in such a way that initially the first subpattern and thereafter the second subpattern is irradiated with the illumination radiation of the illu-mination field. The first subpattern is irradiated during a first illumination time interval with a first angular distribution, adapted to the first subpat-tern, of the illumination radiation. Thereafter, the second subpattern is irradiated during the second illumination time interval with a second an-gular distribution, adapted to the second subpattern, of the illumination radiation, said second angular distribution differing from the first angular distribution.</p> |
