| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure of a light-emitting diode facilitating recognition of whether packaging that is to package spatially close to each other in a single unit is completed, and to provide an optical element that is used for the same. <P>SOLUTION: An LED package structure comprises at least three lenses, having a body provided with at least first to fourth planes and at least three LED chips, having first and second lead wires and embedded in the bodies of the corresponding lenses with the first and second lead wires, extending outside the body from the third plane or the fourth plane of the corresponding lenses. At least three lenses and three LED chips are assembled, by a method in which the first plane of either lens contacts the second plane of one remaining lens of at least three lenses. An LED package structure, in which at least three LED chips are arranged at the positions that are substantially proximate to one another, is adopted. <P>COPYRIGHT: (C)2008,JPO&INPIT |
