| 摘要 |
PROBLEM TO BE SOLVED: To cut-off a sheet so as not to extrude from a plate shape member in a state that the sheet having a size enough to be extruded from the outer periphery of the plate shape member such as a wafer has been stuck to the plate shape member. SOLUTION: After the sheet S having a size enough to be extruded from the outside periphery of a semiconductor wafer W has been stuck to the semiconductor wafer W, a sheet cutting-off apparatus 10 cuts off the sheet along the outer periphery of the semiconductor wafer W. A cutter 13 in the sheet cutting-off apparatus 10 is held by means of an articulated robot 12 or a holding means 50. The blade 13B of the cutter 13 is provided so as to adjust its angle by rotating with the intersection point P of a rounded portion R and the plane of the wafer W or the center C1 of the rounded portion R as a rotation center in a state that the blade 13B has been inserted into the sheet S. By this configuration, the sheet S does not extrude from the outer periphery of the wafer W. COPYRIGHT: (C)2008,JPO&INPIT
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