| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board incorporating an electronic component, such as a semiconductor element in which high reliability can be ensured at electrical junctions. <P>SOLUTION: The multilayer wiring board 1 is manufactured, by laminating a first substrate 10 having a cavity 14 produced by coating a first insulating resin base 11 with filling resin 40 onto a second substrate 20 mounting a semiconductor element 30, such that the semiconductor element 30 is contained in the cavity 14 and then hot-pressing them. The filling resin 40 touches the semiconductor element 30 to embed the side of the semiconductor element 30 facing the first substrate 10. Since the volume of the filling resin 40 is smaller than the volume of a clearance between the semiconductor element 30 contained in the cavity 14 and the inner wall of the cavity 14, an air gap 14a that is not filled with the filling resin 40 is formed in the side face of the semiconductor element 30. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
