发明名称 Light Beam Bonding
摘要 A method for performing soldering using a light beam, and a mask for blocking the light beam are provided. A connecting method is provided, being a method for connecting conducting lines and contacts using a light beam, including a step for installing conducting lines in regions wherein contacts are formed, a step for supplying solder to regions wherein contacts are formed, a step for installing a mask that shields at least a portion of the contacts from a light beam, and a step for connecting conducting lines and contacts by melting solder by illuminating with a light beam.
申请公布号 US2007278278(A1) 申请公布日期 2007.12.06
申请号 US20050593765 申请日期 2005.03.31
申请人 OKANO KAZUYA 发明人 OKANO KAZUYA
分类号 G03F1/00;B23K31/02;H01R11/09;H01R43/02;H05K3/34 主分类号 G03F1/00
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