METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board which enables reduction of unit cost of raw materials by using a coherent conductive material far lower in cost compared with a nano-silver, and can be carried out anywhere since a technique of lithographic printing which is most prevalent in general is used.

SOLUTION: The coherent conductive material is used as conductive powder, and further formation of a circuit pattern using a resin in a pattern manufacturing process is performed by applying the resin multiple times to a base by the lithographic printing. In this manufacturing method for circuit board, a coagulated silver is used as the conductive powder. The conductive powder is metal powder which has the average particle diameter of 0.2-30 μm, and weight attrition rate at 600°C resulting from removal of dispersing agent in a range of 0.01-0.50%.

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