| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device to suppress ripples in output voltage and further suppress increase in loss. <P>SOLUTION: The semiconductor device 2 includes: a metal base substrate 3 obtained by forming a circuit pattern 10 on the upper face of a metal base 9 via an insulating layer 8; MOSFETs 72, 73 mounted on the metal base substrate 3; chip capacitors 4-1 to 4-3 mounted on the metal base substrate 3, and connected with the MOSFET 73 through the circuit pattern 10; and an electrolytic capacitor 75 whose capacitance is larger than the resultant capacitance of the chip capacitors 4-1 to 4-3, and which is connected to the chip capacitors 4-1 to 4-3 through at least the circuit pattern 10. <P>COPYRIGHT: (C)2008,JPO&INPIT |
