发明名称 HIGH-SPEED LOW-POWER INTEGRATED CIRCUIT INTERCONNECTS
摘要 Methods and apparatuses to decrease power consumption of interconnecting devices in integrated circuits are disclosed. Embodiments comprise a method to reduce power consumption in integrated circuits by generating full and reduced swing signals at an output of a driver module in response to a control signal during and deactivating one or more elements to conserve power after an input signal remains unchanged for a period of time. Another embodiment comprises an apparatus to reduce power consumption in a circuit, the embodiment comprising a swing module coupled with a swing selector and an output controller. The swing module may generate full or low swing signals depending on the state of the swing selector. The output controller may increase the output impedance of the swing module after an input signal to the swing module remains unchanged for a quantity of time. Various apparatus embodiments include portable computing devices and cellular telephones.
申请公布号 US2007279097(A1) 申请公布日期 2007.12.06
申请号 US20060421457 申请日期 2006.05.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG ZHIBIN;DUTTA SATYAJIT;KLIM PETER J.
分类号 H03K19/094 主分类号 H03K19/094
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