发明名称 |
SOLDERING METHOD AND SOLDERING EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method and a soldering equipment, which reduce the operation hours for soldering as well as the consumed energy. SOLUTION: The method includes: a preparation process in which a wiring member patterned in a specified shape is prepared; an applying process for applying a solder to a specified position of the wiring member; a mounting process in which a component is mounted on the specified position where the solder is applied; a preheating process for preheating the wiring member on which the component is mounted to a specified temperature; and a light radiation process in which the light having the energy required for melting the solder is irradiated toward the wiring member for heating the wiring member to melt the solder. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007317891(A) |
申请公布日期 |
2007.12.06 |
申请号 |
JP20060145997 |
申请日期 |
2006.05.25 |
申请人 |
DENSO CORP |
发明人 |
MAEDA HIROMITSU;NAGAI HIROYUKI |
分类号 |
H05K3/34;B23K1/00;B23K1/005;B23K31/02;B23K101/42 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|