MATERIAL TREATMENT METHOD BY LASER ABLATION AND MATERIAL TREATED BY THE TREATMENT METHOD

摘要

There is provided a material treatment method using laser ablation capable of easily controlling the laser pulse width and effectively performing treatment with a high accuracy. When a two-logarithm graph is expressed by a horizontal axis indicating the laser pulse width in pico seconds and a vertical axis indicating the ablation threshold value in J/cm^2, a material having a region where the two-logarithm graph has a rectilinear shape with gradient of 0.5 or below is subjected to treatment by a pulse laser beam having a laser pulse width within the region.