MULTILAYER PRINTED WIRING BOARD, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent a drop in interlayer insulation reliability associated with a thinned insulation layer in a manufacturing method of a printed wiring board constituting electronic equipment or the like. SOLUTION: Roughness of a second rough part 106 of a first conductor material 103 included in a first substrate insulator 101 is made smaller than that of a first rough part 105, whereby a part is hard to occur where an interlayer thickness of a second substrate insulator 102 locally decreases. Thus, the second substrate insulator can be thinned while inhibiting short-circuiting between a first conductive circuit 107 and a second conductive circuit 108. COPYRIGHT: (C)2008,JPO&INPIT