| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency switch with excellent isolation. SOLUTION: Semiconductor element bonding equipment 8 has a part 8a of a bandpass filter through which a high frequency signal of a millimeter wave bandpasses by an LC resonance circuit and the remaining part 8b of the bandpass filter. The part 8a and the remaining part 8b of the bandpass filter are separated from each other and the part 8a is provided inside a semiconductor element 10, the remaining part 8b is provided outside (an external circuit 20) the semiconductor element 10, furthermore, in the part 8a and the remaining part 8b, a variable capacitance element is added to a capacitive element and a pass band of a high frequency signal is varied by varying the variable capacitance element. COPYRIGHT: (C)2008,JPO&INPIT |
