发明名称 FILM DEPOSITION METHOD AND FILM DEPOSITION APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition apparatus capable of reducing the ununiformity of film thickness. <P>SOLUTION: The electric potential of a metal substrate B1 is measured during the film deposition, and the blowing condition of aerosol is adjusted based on the result of measurement. Thus, the state of a blowing aerosol X can be comprehended in real time basis, and even during the blowing operation, the electric potential of the substrate is measured, the result is fed back to the blowing condition of the aerosol Z to unify the film thickness. Further, if the electric potential of the metal substrate B1 during the blowing operation is constant, the film of the predetermined thickness can be obtained, and the film of the desired thickness can be easily deposited by adjusting the blowing condition with the electric potential of the metal substrate B1 as an index. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007308748(A) 申请公布日期 2007.11.29
申请号 JP20060137781 申请日期 2006.05.17
申请人 BROTHER IND LTD 发明人 NORIMATSU TAKAHIRO
分类号 C23C24/04;B05D1/02;B05D7/24;C23C14/54;H01L41/18;H01L41/187;H01L41/314;H01L41/39 主分类号 C23C24/04
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