发明名称 METHOD OF PRETREATMENT FOR PLATING AND WATER SERVICE INSTRUMENT MADE OF LEAD-CONTAINING COPPER ALLOY
摘要 <p>[PROBLEMS] To provide a method of pretreatment for plating in which lead, etc. dissolved in an etchant are prevented from being electrodeposited (readhering) to a lead-containing copper alloy as a work to be plated without the necessity of adding a chelating agent which forms an insoluble inert compound. [MEANS FOR SOLVING PROBLEMS] A lead-containing copper alloy as a work to be plated is immersed in an alkaline etchant containing no chelating agent which forms an insoluble inert compound. The lead-containing copper alloy in this state is subjected alternately to electrolysis in which the lead-containing copper alloy is used as one of the positive and negative poles and electrolysis in which the lead-containing copper alloy is used as the other pole (PR electrolysis).</p>
申请公布号 WO2007136024(A1) 申请公布日期 2007.11.29
申请号 WO2007JP60330 申请日期 2007.05.21
申请人 TOTO LTD.;TAKAMATSU, YUICHI;KAWAMOTO, MASASHI;IMAMOTO, MITSUO 发明人 TAKAMATSU, YUICHI;KAWAMOTO, MASASHI;IMAMOTO, MITSUO
分类号 C25D5/14;C25F3/02;C25D5/34;C25D7/00;E03C1/02 主分类号 C25D5/14
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