发明名称 |
METHOD OF PRETREATMENT FOR PLATING AND WATER SERVICE INSTRUMENT MADE OF LEAD-CONTAINING COPPER ALLOY |
摘要 |
<p>[PROBLEMS] To provide a method of pretreatment for plating in which lead, etc. dissolved in an etchant are prevented from being electrodeposited (readhering) to a lead-containing copper alloy as a work to be plated without the necessity of adding a chelating agent which forms an insoluble inert compound. [MEANS FOR SOLVING PROBLEMS] A lead-containing copper alloy as a work to be plated is immersed in an alkaline etchant containing no chelating agent which forms an insoluble inert compound. The lead-containing copper alloy in this state is subjected alternately to electrolysis in which the lead-containing copper alloy is used as one of the positive and negative poles and electrolysis in which the lead-containing copper alloy is used as the other pole (PR electrolysis).</p> |
申请公布号 |
WO2007136024(A1) |
申请公布日期 |
2007.11.29 |
申请号 |
WO2007JP60330 |
申请日期 |
2007.05.21 |
申请人 |
TOTO LTD.;TAKAMATSU, YUICHI;KAWAMOTO, MASASHI;IMAMOTO, MITSUO |
发明人 |
TAKAMATSU, YUICHI;KAWAMOTO, MASASHI;IMAMOTO, MITSUO |
分类号 |
C25D5/14;C25F3/02;C25D5/34;C25D7/00;E03C1/02 |
主分类号 |
C25D5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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