POWER MODULE, SUBSTRATE THEREOF, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To miniaturize a power module without decreasing the junction reliability between a semiconductor chip and a conductor pattern without decreasing the thermal cycle life of the power module, and without deteriorating the quality of the appearance in a substrate for the power module. SOLUTION: In the substrate 14 for power modules, the conductor pattern 12 is brazed onto the surface of a ceramic plate 11 with a brazing material 13, and a semiconductor chip 15 is provided on a surface 12c of the conductor pattern 12. In the substrate 14 for power modules, a solder-pooling recess 12d capable of accumulating the brazing material melted in brazing is formed at an area to the surface of the ceramic plate 11, while being open toward the surface of the ceramic plate 11 on a backside 12b joined to the surface of the ceramic plate 11 in outer surfaces of the conductor pattern 12. COPYRIGHT: (C)2008,JPO&INPIT