| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a power module that can facilitate installation on an HEV, by reducing the size of apparatus. <P>SOLUTION: Semiconductor chips 1a to 1c are mounted at predetermined locations on a surface of a terminal board 40H. Semiconductor chips 2a to 2c are mounted at predetermined locations on surfaces of bus bars 11u to 11w. Elastic bodies 100a to 100c are intervened between a bottom 81 of a housing 30 and the terminal board 40H, and between elastic bodies 200a to 200c are interposed between the lid 80 of the housing 30 and a terminal board 40L. This eliminates the need for a printed circuit board for mounting the semiconductor chips 1a to 1c and 2a to 2c, thereby reducing the size of the apparatus as a whole. <P>COPYRIGHT: (C)2008,JPO&INPIT |
