| 摘要 |
PROBLEM TO BE SOLVED: To obtain a technique capable of achieving the thinning of a copper film in a copper-clad board as a point member on the achievement of the thinning, compacting of a fluororesin printed board or an increase in a frequency while avoiding the various problems of the increase in cost and a waste-liquid treating problem. SOLUTION: In a preforming board Y for the printed board, a treating state removing a copper foil 11 is brought by an etching process dipping in a nitric-acid solution 15 from the copper-clad board (a) laminating and unifying the copper foil 11 on the surface of a resin board using a fluororesin as a raw material. In the preforming board Y, a surface resistance value is set in 1×10<SP>13</SP>to 1×10<SP>15</SP>Ωunder the treating state. COPYRIGHT: (C)2008,JPO&INPIT
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