| 摘要 |
PROBLEM TO BE SOLVED: To secure a higher reliability for the sealing structure of the mounting section of an inkjet head which is connected with a wiring substrate by bonding while reducing the manufacturing cost by decreasing the number of parts. SOLUTION: In the sealigng structure of the mounting section of the inkjet head which is connected with the wiring substrate by bonding, an inner lead of the wiring substrate is completely coated with a base film of the wiring substrate. COPYRIGHT: (C)2008,JPO&INPIT
|
