| 摘要 |
A structure that may be used in substrate solder bumping comprises a substrate ( 110 ), a solder resist layer ( 120 ) disposed over the substrate, a plurality of solder resist openings ( 121 ) in a surface ( 122 ) of the solder resist layer, a conformal barrier layer ( 130 ) having a first portion ( 131 ) over the surface of the solder resist layer and a second portion ( 132 ) in the solder resist openings, a mask layer ( 140 ) over the first portion of the conformal barrier layer, and a solder material ( 150 ) in the solder resist openings over the metal layer. The conformal barrier layer acts as a barrier against interaction between the solder resist layer and the mask layer during solder reflow. |
