| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a downsized light source device capable of emitting emission light from a semiconductor light-emitting element chip without waste. <P>SOLUTION: The light source device 1 has an opposite side of a lead frame 2 mounting the semiconductor light-emitting chip 3 on the lead frame 2 as the bottom part 4, and is composed of three side face parts 5a, 5b, 5c opposed to this bottom part 4 and connected to the bottom part 4 while surrounding a light emitting part 7 to emit the emission light from the semiconductor light emitting chip 3. By this, the light source device 1 has a part of one side face (transparent side face 6) opened and not molded, and has the light emitting part 7. Thereby, it is easy when carrying out die-bonding of the semiconductor light emitting element chip 3 and also easy to bond bonding wires 8 to the semiconductor light emitting element chip 3 and the lead frame 2, then the thickness of the light source device can be made thinner according to a degree of the absence of one side face. <P>COPYRIGHT: (C)2008,JPO&INPIT |
