CARBON NANOTUBE-BASED STRUCTURES AND METHODS FOR REMOVING HEAT FROM SOLID-STATE DEVICES

摘要

One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ~1350 cm^-1 with an intensity I_D, a G peak at ~1585 cm^-1 with an intensity I_G, and an intensity ratio I_D / I_G of less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cm²K/W or less.