USE OF DIE-ATTACH COMPOSITION FOR HIGH POWER SEMICONDUCTOR, METHOD FOR BONDING THE SAME COMPOSITION TO PRINTED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE PRODUCED THEREBY

摘要

PROBLEM TO BE SOLVED: To provides a lead-free adhesive composition die-attach composition for die-attach application of power semiconductor surely withstanding maximum and minimum temperatures in a soak time of 15 min during at least 1,000 cycle test in temperature cycle by JEDEC test condition "H" and generating heat leakage which is similar to that of a currently-used solder having high lead content. SOLUTION: The die-attach composition is used for attaching high power semiconductor devices to printed circuit boards. The die-attach composition comprises a two-component adhesive and metal powder, and a first component of the adhesive is an epoxy resin and a second component of the adhesive is a curing agent and a metal of the metal powder has a heat conductivity not lower than 250 W/(m×K) and contains copper and the powdery particles have spheroidal shape. COPYRIGHT: (C)2008,JPO&INPIT