THIN FILM CIRCUIT DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a thin film circuit device capable of improving electric connection reliability and of preventing disconnection of connection wiring, and to provide its manufacturing method, and electronic equipment provided with the thin film circuit device. SOLUTION: The thin film circuit device has: a circuit substrate 1 provided with a wiring part 2; a thin film element 10 mounted on the circuit substrate 1 and provided with a connection terminal part 13 at a lower position than an element surface; an insulation inclined part 3 formed on the circumference of the thin film element 10 on the circuit substrate 1 and having an inclined face leading from the element surface to the surface of the circuit substrate 1; and the connection wiring 4 formed to extend from the connection terminal part 13 through the insulation inclined part 3 to the wiring part 2. A projection electrode 14 eliminating a step between the connection terminal part 13 and the element surface is provided on the connection terminal part 13 to connect the connection terminal part 13 and connection wiring 4 through the projection electrode 14. COPYRIGHT: (C)2008,JPO&INPIT