发明名称 MULTI-PIECE WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which has a defective/non-defective display unit capable of displaying defective/non-defective of each of wiring boards and easily recognizing it, and can be efficiently manufactured while suppressing an increase in an area and adverse effects on the products; and to provide a manufacturing method thereof. SOLUTION: The multi-piece wiring board 10 in which a plurality of wiring boards 1A-1D are formed on a single base material sheet is provided with defective/non-defective display pads 1a-1d made of the same conductive material, as that of electrode terminals 8a-8e or connection wirings 9a-9e on each of the wiring boards 1A-1D. Further, a solder resist film 7 is formed on the upper surface of each of the defective/non-defective display pads 1a-1d. For a wiring board determined as defective in an inspection step, a solder resist film 7 on the defective/non-defective display pads 1a-1d is removed. In this way, the presence or absence of the solder resist film 7 on the defective/non-defective display pads 1a-1d is confirmed, thereby confirming whether the wiring boards 1A-1D are each defective or non-defective. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007305838(A) 申请公布日期 2007.11.22
申请号 JP20060133582 申请日期 2006.05.12
申请人 EPSON TOYOCOM CORP 发明人 SHIBATA KOZO
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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