| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can prevent deformation of a metal can package when a component having a metal can sealing-type structure is sealed with resin to form a mold package. <P>SOLUTION: The present semiconductor device is formed such that, when a ceramic substrate 11 is sealed with a synthetic resin material to form a mold package, an injection molding die is filled with a heat-melted synthetic resin material while the ceramic substrate 11 is set inside the injection molding die. In a ceramic oscillator 17, a metal plate 23 is pasted onto the upper surface of a most deformable metal can package 21 to reinforce it, and so, the upper surface of the metal can package 21 will never be deformed by infusion pressure of the synthetic resin material in forming a mold package, thus preventing malfunction of a piezoelectric ceramic oscillator 25 accompanied by the deformation of the metal can package 21. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
