| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist composition capable of improving sensitization speed, film retention, development contrast and resolution of a photoresist film, the solubility of a polymer resin, adhesive power to a substrate and uniformity of circuit line width. <P>SOLUTION: The photoresist composition comprises (a) a novolac resin represented by chemical formula (1), (b) a diazide-based photosensitive compound and (c) an organic solvent, wherein R is H, -OH or -CH<SB>3</SB>, and n is an integer of 3-20. <P>COPYRIGHT: (C)2008,JPO&INPIT |
