发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To prevent a shortage of a connection pad for a power supply to a core region, to eliminate a necessity for decreasing a cell width of an IO cell, and to be able to apply an identical connection method to the all connection pads. <P>SOLUTION: A line of connection pads 41a to 41c and a line of connection pads 42a to 42d are arranged on IO cells 31a to 31g in an IO region 30 in a shifted manner, connection pads 43a to 43d are arranged on a core power wiring 21 among a side of a core region 20, and three connection pads per two IO cells are arranged with the relation between the respective pad pitch P of the connection pads 41a to 41c, 42a to 42d, 43a to 43d; the cell pitch S in the IO cells defined as P=2S; and the pad pitch of all connection pads 41a to 41c, 42a to 42d, 43a to 43d defined as P/3 (=2S/3). <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007305822(A) 申请公布日期 2007.11.22
申请号 JP20060133255 申请日期 2006.05.12
申请人 KAWASAKI MICROELECTRONICS KK 发明人 KINUGASA HAJIME
分类号 H01L21/822;H01L21/3205;H01L21/60;H01L23/52;H01L27/04 主分类号 H01L21/822
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