发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTION MATERIAL AND CONNECTION STRUCTURE, AND CONNECTION METHOD FOR CIRCUIT MEMBER |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition attaining secure insulation between neighboring connecting terminals, when circuit members having a minute connecting terminal are mutually connected, and a circuit connection material using the composition. SOLUTION: This adhesive composition 50 comprises an adhesive component 20 and electroconductive particles 10A dispersed in the adhesive component 20, wherein the conductive particle 10A comprises a nuclear particle 1 having conductivity and an insulating coating containing an organic polymer compound and being placed on the surface of the nuclear particle, and has a coverage in the range of 20-50% defined by formula (1); coverage (%)=(a part of the surface area of the nuclear particle covered by the insulating coating/total surface area of the nuclear particle)×100. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2007302869(A) |
申请公布日期 |
2007.11.22 |
申请号 |
JP20070010625 |
申请日期 |
2007.01.19 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TAKETAZU JUN;TANAKA MASARU;KANOTA HIDEJI |
分类号 |
C09J201/00;C09C1/00;C09C3/06;C09C3/10;C09J5/06;C09J7/02;C09J9/02;C09J163/00;C09J171/10;H01B1/00;H01B1/22;H05K3/32 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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