| 摘要 |
A method for fabricating microchip devices is provided. The method includes the steps of providing a first planar substrate, locating at least one first alignment feature in the surface of the first planar substrate, and bonding a second substrate to the surface of the first planar substrate. The method further includes the step of aligning subsequent process operations performed on at least one of the first and second substrates to visible alignment features of the first substrate, wherein the visible alignment features are at least one of the first alignment feature and a visible feature that corresponds to the location of the first alignment feature.
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