Epoxy-polysiloxanharzzusammensetzungen, damit eingekapselte Halbleitereinrichtungen und Verfahren

摘要

A curable epoxy resin composition comprises a silicone resin(s), an epoxy resin(s), an anhydride curing agent(s), a siloxane surfactant(s), and an ancillary curing catalyst(s). An independent claim is also included for a packaged solid device comprising a package, a chip (4), and an encapsulant (11) comprising the resin composition.