| 摘要 |
<p>PURPOSE: A stacked semiconductor package is provided to decrease the number of wire bonding and to improve electrical properties by using a bump. CONSTITUTION: The stacked semiconductor package comprises a substrate(31), the first semiconductor chip(32), the second semiconductor chip(33) and a conductive bump(34). A connecting pad(31a) is formed in the substrate. A plurality of first pads(32a) for bump and bonding pads(32b) are formed in the first semiconductor chip(32). A plurality of second pads(33a) for bump are formed at the rear surface of the second semiconductor chip(33). The conductive bump(34) is attached to the first pads(32a) and electrically connected to the second pads(33a). The bonding pad(32b) of the first semiconductor chip(32) is bonded to the connecting pad(31a) by a wire(35).</p> |
