| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device exhibiting excellent heat dissipation effect and high reliability as a product. <P>SOLUTION: Since a first metal layer 21 and an insulation layer 22 are formed sequentially on the substrate 20 of the light emitting device, heat is dissipated from a light emitting element 23 through the substrate 20 or the first metal layer 21 exhibiting high thermal conductivity. As compared with prior art, surface of the first metal layer 21 on the substrate 20 is subjected to insulation processing, and heat dissipation effect can be enhanced by forming an insulation layer 22 having a high heat conduction coefficient. Furthermore, since it is not required to use conductive adhesive, adverse effect on the reliability of a product due to deterioration of conductive adhesive is avoided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
