| 摘要 |
A polishing pad conditioning device for a chemical mechanical polishing apparatus and a method thereof are provided to uniformly condition a polishing pad by permitting an arm to be driven in a semi-circular trajectory and arranging a small diamond disk on the arm. A polishing pad conditioning device for a chemical mechanical polishing apparatus, includes an arm driving motor(10), an arm(20), and a holder(30). The arm driving motor is positioned within a revolutionary spindle, and periodically changes rotation direction of a rotary shaft. The arm has the rotary shaft arranged on a bottom surface of the spindle in such a manner that one end of the arm reciprocates along a semi-circular trajectory of a radius of a polishing pad by force generated from the arm driving motor. The holder is joined to a bottom surface of one end of the arm, and has a bottom surface on which a small diamond disk(31) is attached. The polishing pad conditioning device further includes a holder accommodating unit joined to the arm such that the holder accommodating unit is rotatable, a disk driving motor(40) for rotating the holder accommodating unit, and a pressure control unit for controlling vertical movement of the holder housed in the holder accommodating unit.
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