| 摘要 |
<p>For providing a reflection type light emitting diode that is free from a drop of reflectivity attributed to deterioration of reflective surface (21) and excels in productivity, light emitting element (11) is disposed opposite to reflective surface (21) in the concave space of reflective surface formation material (22) constituted of a resin such as polyether ketone, and the interspace (41) between the light emitting element (11) and the reflective surface formation material (22) is filled with transparent epoxy resin (44). The hardening temperature of transparent epoxy resin (44) is set for 180°C or below to avoid deterioration of the reflection performance of the reflective surface (21) of the reflective surface formation material (22).</p> |
