发明名称 MINUTE STRUCTURE INSPECTION DEVICE, MINUTE STRUCTURE INSPECTION METHOD, AND MINUTE STRUCTURE INSPECTION PROGRAM
摘要 A speaker unit (2) has a plurality of sound sources each outputting a sound wave. The compressional, sound wave output from the speaker unit (2) arrives, or vibrates air, which moves a movable part of a three-axis acceleration sensor, or a microstructure of a chip to be tested TP. As the movable part thus moves, a value in resistance accordingly varies, and such variation is measured as based on an output voltage provided via a probe (4). A control unit (20) determines a property of the three-axis acceleration sensor from a value in property as measured or measurement data. Furthermore, the plurality of sound sources can be spaced by a pitch of a predetermined value set as based on their difference in the distance to the movable part of the three-axis acceleration sensor and the wavelength of the test wave to apply a composite test wave to the movable part such that the composite sound wave's composite sound field is maximized.
申请公布号 EP1855107(A1) 申请公布日期 2007.11.14
申请号 EP20060715105 申请日期 2006.03.02
申请人 TOKYO ELECTRON LIMITED 发明人 MATSUMOTO, TOSHIYUKI;IKEUCHI, NAOKI;YAKABE, MASAMI;ENJOJI, KEIICHI;HAYASHI, MASATO
分类号 G01N29/00;G01N29/12;G01P21/00 主分类号 G01N29/00
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