发明名称 |
Electronics assembly having multiple side cooling and method |
摘要 |
An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.
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申请公布号 |
US7295433(B2) |
申请公布日期 |
2007.11.13 |
申请号 |
US20050262400 |
申请日期 |
2005.10.28 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
TAYLOR RALPH S.;JETER MICHAEL A.;GERBSCH ERICH W.;RONNING JEFFREY J. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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