| 发明名称 |
THERMALLY CONDUCTIVE MOLDING MATERIAL AND MOLDED SHEET USING THIS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally conductive molding material which has a high thermal conductivity and is easily processed into a thin layer. <P>SOLUTION: The thermally conductive molding material consists of a pitch-based carbon fiber staple A having a specified aspect ratio in addition to a specified average fiber diameter and an average fiber length and an expansion graphite B. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2007291267(A) |
申请公布日期 |
2007.11.08 |
| 申请号 |
JP20060121939 |
申请日期 |
2006.04.26 |
| 申请人 |
TEIJIN LTD |
发明人 |
HARA HIROSHI;HIRATA SHIGEKI;SANO HIROKI |
| 分类号 |
C09K5/08;C01B31/04;C08K3/04;C08K7/06;C08L101/00 |
主分类号 |
C09K5/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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